Carrier Tape-NEXTECK_Precision alloy_Electrothermal alloys_Sputtering plate

Carrier Tape

Recommend

Providing real-time and high quality service

EC and Clearen Sheet have been used and reputed as standard materials for carrier tapes.

Various grades available for semiconductors and electronic components.

Years of accumulation and trust
Completed carrier tapes for semiconductor and electronic parts

3. Ultra-thin and high strength EC-AP sheet for parts miniaturization developed recently.

Product Features
Suitable for various molding methods and shows good moldability and size accuracy. Excellent sealing performance with covertapes. Stable conductivity to protect contents from static electricity. High transparency for easy recognition of contents. (CST-2401) Higher strength and ultra-thin than the former PC series sheets.(EC-AP2) Anti-static performance to prevent carrier sheet from dust. (EC-TP2)

Structure	EC-R	EC-M3	EC-AP2	CST-2401
Surface	Conductive PS	Conductive PS	Conductive PC	Special PS（single layer）
Core	PS	ABS	ABS
Surface	Conductive PS	Conductive PS	Conductive PC

Sheet Properties and Applications (Sheet thickness: 0.3mm)
Item	Unit	Method	EC-R (General Type)	EC-M3 (High Strength Type)	EC-AP2 (Ultra High Strength Type)	CST-2401 (Transparent Type)
Color	-	-	Black	Black	Black	Clear
Surface Resistivity	Ω	JIS K 7194	104 - 106	104 - 106	104 - 106	1014 <
Hertz	%	JIS K 7105	-	-	-	20
Tensile ( Yield)	MPa	JIS K 7127	21	43	50	39
Tensile (break)	MPa		22	42	41	31
Modulus	MPa		1420	1730	1720	1630

Each items of NEXTECK win years of accumulation and trust. Products used for semiconductors and electronic parts are very completed and with varied shaping methods，excellent forming property and size precision.

Application

Active Component

Active Component

Passive Component（connectors etc.）

High Weight Device

Vacuum Trays (module)