| TR-5917A  Conductor R-5917A is a silver and palladium paste without lead, mainly used for chip resistors. By advanced technology of metal powder and Frit mixing system, the product stickiness is quality. | |
| Features | |
| Metal Alloy | 99.5 Ag / 0.5 Pd | 
| Target Metal Content | 72.50% | 
| Solid Content | 77% ± 2% | 
| Recommended Processing | |
| Printing | 325 mesh stainless steel screen | 
| Drying | 150℃,3 min | 
| Firing | 850℃,8~10 min (for peak-temperature) | 
| The total firing time is 45~60 minutes. | |
| Viscosity | 220± 20k cps. | 
| (Brookfield, HBT DVll, SC4-14 | |
| 10r.p.m. at 25℃) | |
| Thinner | T-307 | 
| Shelf life | 6 months in sealed container (20℃ ± 5℃) | 
| Remark | The actual specification is subject to the product approval sheet. | 
| TR-5917B1 Conductor | |
| TR-5917B1 is a silver and palladium paste without lead, mainly used for chip resistors of low temperature coefficient . The excellent stickiness is formed by putting silver in a special frit system to output coating and then melted and plated. | |
| Features | |
| Metal Alloy | 99.5 Ag / 0.5 Pd | 
| Target Metal Content | 72.5% ± 2% | 
| Solid Content | 78.2% ± 2% | 
| Recommended Processing | |
| Printing | 325 mesh stainless steel screen | 
| Drying | 150℃,3~5 min | 
| Firing | 850℃,8~10 min (for peak-temperature) | 
| The total firing time is 35~45 minutes. | |
| Viscosity | 200~240k cps. | 
| (Brookfield, HBT DV-E, SC4-14 | |
| 10rpm at 25℃) | |
| Thinner | T-301 | 
| Shelf life | 6 months in sealed container (5℃~30℃) | 
| Remark | The actual specification is subject to the product approval sheet. | 
| TR-5932S Conductor | |
| TR-5932S is lead-free pure silver conductive paste, mainly used in small size chip resistors. It uses silver in a special frit system to output quality stickiness and acidoresistance in the alumina substrate. | |
| Features | |
| Metal Alloy | 100% Ag | 
| Target Metal Content | 55% | 
| Solid Content | 59.5% ± 2% | 
| Recommended Processing | |
| Printing | 400 mesh stainless steel screen | 
| Drying | 150℃,3 min | 
| Firing | 850℃,10~12 min (for peak-temperature) | 
| The total firing time is 45~60 minutes. | |
| Viscosity | 180 ± 20k cps. | 
| (Brookfield, HBT DVll, SC4-14 | |
| 10r.p.m. at 25℃) | |
| Thinner | T-301 | 
| Shelf life | 6 months in sealed container (5 ~ 30℃) | 
| Remark | The actual specification is subject to the product approval sheet. | 
Each items of NEXTECK win years of accumulation and trust. Products used for semiconductors and electronic parts are very completed and with varied shaping methods,excellent forming property and size precision.


 
	   
					